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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
LG2040/TRF-X
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LG2040/TRF-X B 07 - Jun. - 2006
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG2040/TRF-X Page 1/6
Package Dimensions
H
P2
H2
H1 H L W0
W2
W1 W3
D
P1 F P
-
+
T
LG2040
3.0 4.0
4.2
5.2
1.5MAX 25.0MIN
0.5 TYP
1.0MIN 2.54TYP + -
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG2040/TRF-X Page 2/6
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol G Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 30 120 100 10 -40 ~ +85 -40 ~ +100 Max 260 for 5 sec Max (2mm from body) mA mA mW UNIT
A
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL Emitted
COLOR
Peak wave length
Pnm
Forward Spectral voltage halfwidth @ 20mA(V) nm
Luminous intensity
@10mA(mcd)
Viewing angle 2 1/2 (deg)
Lens 565 30
Min. Max. Min. Typ. 1.7 2.6 12 30 36
LG2040/TRF-X
GaP
Green Green Diffused
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG2040/TRF-X *Dimensions Symbol Information SPECIFICATIONS SYMBOL ITEMS
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Height Of Seating Plane
Page 3/6
OPTION SYMBOL CODE
-------------------------
Minimum mm inch
0.15 0.19
-------
Maximum mm
4.2 5.8 2.0 16.5 19.5 21.0 24.5 26.5 22.5 21.2 21.125 22.5 28.0 26.0 23.0 36 11.0
inch
0.17 0.23 0.08 0.65 0.77 0.83 0.96 1.04 0.89 0.83 0.83 0.89 1.1 1.02 0.91 1.42 0.43 0.51 0.18 0.3 0.06 0.38 0.61 0.16 0.75
D F
H
3.8 4.8
-------
H
15.5 17.5 19.0 22.5 25.5 21.5
0.61 0.69 0.75 0.89 1.0 0.85 0.8 0.67 0.79 1.02 0.94 0.83
-------
TRF-1 TRF-2 TRF-3 TRF-4 TRF-5 Feed Hole To Bottom Of Component TRF-6 TRF-7 TRF-8 TRF-9 TRF-11 TRF-12 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
H1
20.2 17.125 20.0 26.0 24.0 21.0
H2 L P P1 P2 T W0 W1 W2 W3
-------
W0 12.4 3.15 5.1
-------
0.49 0.12 0.2
-------
13.0 4.55 7.7 1.42 9.75 15.5 4.0 19.0
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TRF=Tape And Reel Forming Leads
* Dimensions Symbol Information
Specification Description
Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness
* Package Dimensions
minimum mm inch 3.08 1.37 1.13 0.54 --1.18 2000PCS maxmum mm 380 102 88.0 38.1 57.2 50.0 inch 14.96 4.02 3.46 1.5 2.25 1.97 D T1 T2
MARKING
Symbol D D1 D2 D3 T T1
D3 D2 D1
78.2 34.9 28.6 13.8 --30.0
LG2040/TRF-X
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG2040/TRF-X *Dimensions Symbol Information SPECIFICATIONS SYMBOL ITEMS
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Height Of Seating Plane
Page 4/6
OPTION SYMBOL CODE
-------------------------
Minimum mm inch
0.15 0.19
-------
Maximum mm
4.2 5.8 2.0 16.5
20.0 23.7 23.5 18.0 19.5 21.5
inch
0.17 0.23 0.08 0.65
0.79 0.93 0.93 0.71 0.77 0.85
D F
H
3.8 4.8
-------
H
15.5
19.0 21.7 22.5 17.5 18.5
0.61
0.75 0.85 0.89 0.69 0.73 0.81
TRF-13 TRF-14 TRF-15 TRF-16 TRF-17 Feed Hole To Bottom Of Component TRF-18 TRF-19 TRF-20 TRF-21 TRF-22 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width H1
20.5
25.5 20.5 25.0 22.0
1.0 0.81 0.98 0.87
27.5 22.5 27.0 23.0
1.08 0.89 1.06 0.91
-------------------------------------------------------------
H2 L P P1 P2 T W0 W1 W2 W3
-------
-------
36 11.0
1.42 0.43 0.51 0.18 0.3 0.06 0.38 0.61 0.16 0.75
W0 12.4 3.15 5.1
-------
0.49 0.12 0.2
-------
13.0 4.55 7.7 1.42 9.75 15.5 4.0 19.0
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TRF=Tape And Reel Forming Leads
* Dimensions Symbol Information
Specification Description
Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness
* Package Dimensions
minimum mm inch 3.08 1.37 1.13 0.54 --1.18 2000PCS maxmum mm 380 102 88.0 38.1 57.2 50.0 inch 14.96 4.02 3.46 1.5 2.25 1.97 D T1 T2
MARKING
Symbol D D1 D2 D3 T T1
D3 D2 D1
78.2 34.9 28.6 13.8 --30.0
LG2040/TRF-X
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG2040/TRF-X Page 5/6
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.5
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25
1.1 1.0
0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25
1.2
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
1.0
0 -30 30
Relative Intensity @20mA
0.5
-60
60
0.0 500 550 600 650
100% 75% 50%
25%
0
25% 50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LG2040/TRF-X Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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